| Title: |
Predicting electromigration mortality under temperature and product lifetime specifications |
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| Authors: |
Vivek Mishra |
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University of Minnesota, Department of Electrical and Computer Engineering
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| Sachin S. Sapatnekar |
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University of Minnesota, Department of Electrical and Computer Engineering
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| Sharing: |
Unknown
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| Verification: |
Authors have
not verified
information
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| Artifact Evaluation Badge: |
none
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| NSF Award Numbers: |
1421606,
1162267
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| DBLP Key: |
conf/dac/MishraS16
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| Author Comments: |
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