| Title: |
Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package |
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| Authors: |
Yu-Chieh Huang |
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National Tsing Hua University, Hsinchu, Taiwan, Department of Electrical Engineering
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| Bing-Yang Lin |
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National Tsing Hua University, Hsinchu, Taiwan, Department of Electrical Engineering
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| Cheng-Wen Wu |
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National Tsing Hua University, Hsinchu, Taiwan, Department of Electrical Engineering
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| Mincent Lee |
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Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, Taiwan
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| Hao Chen |
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Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, Taiwan
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| Hung-Chih Lin |
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Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, Taiwan
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| Ching-Nen Peng |
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Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, Taiwan
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| Min-Jer Wang |
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Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, Taiwan
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| Sharing: |
Unknown
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| Verification: |
Authors have
not verified
information
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none
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| DBLP Key: |
conf/dac/HuangLWLCLPW16
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| Author Comments: |
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