| Title: |
Redistribution layer routing for integrated fan-out wafer-level chip-scale packages |
| Article URLs: |
|
| Alternative Article URLs: |
|
| Authors: |
Bo-Qiao Lin |
-
National Taiwan University, Graduate Institute of Electronics Engineering
|
| Ting-Chou Lin |
-
National Taiwan University, Graduate Institute of Electronics Engineering
|
| Yao-Wen Chang |
-
National Taiwan University, Graduate Institute of Electronics Engineering
-
National Taiwan University, Department of Electrical Engineering
|
| Sharing: |
Unknown
|
| Verification: |
Authors have
not verified
information
|
| Artifact Evaluation Badge: |
none
|
| Artifact URLs: |
|
| Artifact Correspondence Email Addresses: |
|
| NSF Award Numbers: |
|
| DBLP Key: |
conf/iccad/LinLC16
|
| Author Comments: |
|