Title: |
Minimizing Thermal Gradient and Pumping Power in 3D IC Liquid Cooling Network Design |
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Authors: |
Gengjie Chen |
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The Chinese University of Hong Kong, CSE Department
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Jian Kuang |
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The Chinese University of Hong Kong, CSE Department
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Zhiliang Zeng |
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The Chinese University of Hong Kong, CSE Department
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Hang Zhang |
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The Chinese University of Hong Kong, CSE Department
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Evangeline F. Y. Young |
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The Chinese University of Hong Kong, CSE Department
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Bei Yu |
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The Chinese University of Hong Kong, CSE Department
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Sharing: |
Unknown
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Verification: |
Authors have
not verified
information
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Artifact Evaluation Badge: |
none
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NSF Award Numbers: |
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DBLP Key: |
conf/dac/Chen0ZZYY17
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Author Comments: |
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