Design Automation Conference, DAC 2017


Article Details
Title: Minimizing Thermal Gradient and Pumping Power in 3D IC Liquid Cooling Network Design
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Authors: Gengjie Chen
  • The Chinese University of Hong Kong, CSE Department
Jian Kuang
  • The Chinese University of Hong Kong, CSE Department
Zhiliang Zeng
  • The Chinese University of Hong Kong, CSE Department
Hang Zhang
  • The Chinese University of Hong Kong, CSE Department
Evangeline F. Y. Young
  • The Chinese University of Hong Kong, CSE Department
Bei Yu
  • The Chinese University of Hong Kong, CSE Department
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DBLP Key: conf/dac/Chen0ZZYY17
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